> Project Description:
The utilization of the VLC technology for high-speed in-house communications constitutes the object of this project.
This technology is applicable in places of high requirements for connectivity (airports, technological parks, multipurpose rooms),
in promotional and advertising places (such as exhibitions), in supply chain management and product distribution places (logistics),
even in places of high cultural and creativity interest (such as museums). The goal is to implement innovations of visible light technology
in a number of market segments. In
particular, the application targets on approaching the employees / visitors of these places giving them the opportunity to use their gadgets
(laptop, tablet, mobile phone) in order to get information.
LiFi consists a system based on communication throughout the visible light (Visible Light Communication (VLC)). Simply, the transmitters
will be LEDs, which will be flashing as quickly as not being perceived from the human eye. The recipient will be a light-eye which is
going to collect the light and a device which will translate the LED’s flash sign into 0 and 1, in a “streamable” language perceivable
from the computers.
> Project Description:
The reliability of integrated circuits and systems (ICS) is a major concern in modern semiconductor technologies.
The target in this project is to enchance ICS reliability through the development of self-healing techniques against
failures during their operation due to aging mechanisms or environmental factors (noise, temperature or power supply disturbances).
> Project Description:
CMOS technology evolution has allowed the integration of a large number of
cores on the die (System-on-Chip). However, shrinking geometries and greater
design complexity has led to reliability challenges. One-time factory testing
of VLSI circuits after fabrication is insufficient in the nanometer era, making
periodic testing in the field necessary. Test data volume, test application
time and power consumption during testing are critical parameters for both
manufacturing as well as in the field testing. Variability, aging, power supply
deviations and temperature effects can lead to intermittent faults and in some
cases to catastrophic faults as well. Finally, technology scaling has increased
the logic and SRAM memory susceptibility to radiation that leads to transient
errors.
> Project Description:
Research on DRAM fault models and the development of testing algorithms and built-in self test techniques.